SiC WebAd SemiWiki Forum2026 800x100 Static

Beyond the Post-Mortem: How yieldHUB Live Turns the Test Floor Into an Open Window

Beyond the Post-Mortem: How yieldHUB Live Turns the Test Floor Into an Open Window
by Lauro Rizzatti on 10-21-2026 at 10:00 am

Live visibility on the semiconductor test floor (1)

At SEMICON West 2026 I sat down with John O’Donnell, founder and CEO, and Gillian O’Donnell, Director of Growth, to talk about how yieldHUB Live is transforming the semiconductor test floor from a blind spot into a real-time command center.

For decades, semiconductor test floors have operated as high-stakes black… Read More


Why America’s Semiconductor Manufacturing Capacity Matters

Why America’s Semiconductor Manufacturing Capacity Matters
by Daniel Nenni on 10-21-2026 at 8:00 am

Building America's chip future

America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More


Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent Networks

Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent Networks
by Bernard Murphy on 10-21-2026 at 6:00 am

MultiDie FlexGen

Last year I wrote about Arteris’ introduction of multi-die support for coherent NoCs. This is a very big deal because hyperscalers and OEMs are now building large systems that depend on multi-chiplet architectures and require efficient traffic management between chiplets, in one case as many as 12 compute, fabric/cache and … Read More


The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip

The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
by Kalar Rajendiran on 10-20-2026 at 10:00 am

Partners Photo Op scaled

Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected

Artificial intelligence is changing what the semiconductor industry must deliver. … Read More


Who Gets to Move the Recipe? How Autonomous Agents Earn Decision Authority in the Fab

Who Gets to Move the Recipe? How Autonomous Agents Earn Decision Authority in the Fab
by Admin on 10-20-2026 at 8:00 am

featured who gets to move the recipe

by Ajay Kumar Govindaram

There’s a question I’ve started asking at every agentic AI demo I sit through, and it has a clean answer in every fab on earth: who is allowed to change the recipe? In a semiconductor factory, that was settled decades ago. A person doesn’t touch a production recipe because they feel confident.… Read More


Smoothing the Quantum Path: ASML and Xanadu Target Photon Loss

Smoothing the Quantum Path: ASML and Xanadu Target Photon Loss
by Daniel Nenni on 10-20-2026 at 6:00 am

ASML and Xanadu Target Photon Loss

ASML’s decision to collaborate with Xanadu targets one of photonic quantum computing’s most unforgiving engineering constraints: photon loss. The companies will investigate advanced lithography processes for Xanadu’s photonic quantum hardware, focusing on whether tighter patterning control can suppress loss mechanisms… Read More


Sir Arthur C. Clarke Deserves a Nobel Prize

Sir Arthur C. Clarke Deserves a Nobel Prize
by Daniel Nenni on 10-19-2026 at 6:00 pm

Silicon Catalyst Forum Nov 2026 IIII

By Richard Curtin

Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”) I’ve been convinced that the Nobel Prize committee needs to consider awarding a posthumous award to Sir Arthur.

To remind you, Sir Arthur’s “2001: A Space Odyssey” movie was released in 1968. At that point in time… Read More


Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering

Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering
by Mike Gianfagna on 10-19-2026 at 10:00 am

Agentic Loops, Autonomous Chip Design

At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with AI in the design loop. As reported from the session by ServeTheHome and Tom’s Hardware, OpenAI showed measured block-level wins over a human baseline — 56% on a BF16 multiply, alongside a 10% smaller matrix-unit area — within a roughly nine-month path from… Read More


Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity

Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity
by Admin on 10-19-2026 at 8:00 am

5439ea1b 1ae1 4770 9117 ada707e8e1d3 1 all 6144

Byline: Richard Shreiner

​Modern semiconductor architectures are pushing the absolute limits of physical scaling. As data rates climb into sub-picosecond regimes across high-performance computing, 5G/6G infrastructure, and advanced AI clusters, physical layer (Layer 1) signal integrity has shifted from an engineering… Read More


Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips

Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips
by Daniel Nenni on 10-19-2026 at 6:00 am

Accelerating Lithography for AI Chips

Siemens has announced advances in its collaboration with NVIDIA to accelerate computational lithography, addressing a demanding step in manufacturing advanced AI semiconductors. By integrating NVIDIA’s cuLitho library with Siemens Calibre manufacturing software, the companies aim to make sophisticated photomask optimization… Read More