As Photonic Integrated Circuits (PIC) continue to gain momentum across datacom, telecom, AI infrastructure, sensing, and quantum computing applications, the need for advanced manufacturing analytics has become increasingly critical. To address the challenges associated with scaling PIC production while maintaining… Read More
Alchip Accelerates on AI ASIC DemandAlchip Technologies reported improved financial results for the…Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys ToolsAs advanced packaging becomes a critical enabler for…Read More
TSMC Expands Use of NVIDIA AI Technologies Across Chip Production OperationsTSMC, the world’s largest contract semiconductor manufacturer, is…Read More
Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative EvidenceThe semiconductor industry is generating more engineering data…Read More
An Update on IP Lifecycle Management (IPLM)IPLM is not always prominent, nevertheless it is…Read MoreDisaggregating AI Compute to Break the Tokens Barrier
Among several topics dominating news streams these days, giant datacenters are a leading theme. They point to an AI-centric future while raising real concerns about sustainability and scalability. Certainly land, power and water demand are very present concerns for most of us, witness growing pushback against building new… Read More
Customized Foundation IP Enables the Next Generation of Automotive Compute
As vehicles become increasingly software-defined, automotive semiconductor suppliers face growing pressure to deliver higher compute performance while maintaining strict requirements for power efficiency, reliability, and long-term product support. Advanced driver assistance systems (ADAS), electrification, … Read More
Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory Modules
The rapid emergence of AI-enabled personal computers is driving unprecedented demand for higher memory bandwidth, improved signal integrity and greater system reliability. To address these requirements, Rambus has introduced a complete client memory interface chipset for Clocked Unbuffered Dual In-Line Memory Modules… Read More
From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization
Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More
Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die Systems
At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More
Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.
Hock Tan and his CFO Kirsten Spears logged into the June 3 earnings call with numbers that should have satisfied anyone. AI semiconductor revenue hit $10.8 billion in Q2, up 143% year over year, above Broadcom’s own forecast. Full-year AI guidance went to $56 billion. The $100 billion fiscal 2027 target was reaffirmed. By any prior… Read More
Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone
Weebit Nano has achieved a critical milestone in the commercialization of Resistive Random Access Memory (ReRAM) technology with the successful tape-out of two customer products integrating its embedded non-volatile memory IP. One of the products has already returned first silicon and demonstrated functional operation,… Read More
CEO Interview with Chuck Gershman of Owl Autonomous Imaging
Chuck Gershman is the CEO and co-founder of Owl Autonomous Imaging. He has spent more than 30 years in semiconductors, AI imaging, computer vision, and autonomous sensing technologies across executive management, engineering, marketing, business development, and operations.
Chuck is a Drexel University College of Engineering… Read More
CEO Interview with Mike Horton of HYFIX Spatial Intelligence
Mike Horton is a co-founder of HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks, and GEODNET, the world’s largest decentralized GNSS reference network, and HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks.… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools