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Podcast EP360: IDA Ireland’s Role to Expand Ireland’s Footprint Across the Semiconductor Ecosystem with Anne-Marie Tierney

Podcast EP360: IDA Ireland’s Role to Expand Ireland’s Footprint Across the Semiconductor Ecosystem with Anne-Marie Tierney
by Daniel Nenni on 08-14-2026 at 2:00 pm

Daniel is joined by Anne-Marie Tierney, Divisional Manager at IDA Ireland. Anne-Marie has 24 years’ experience in the global investment environment with IDA Ireland, working across several key roles in Ireland and abroad, positioning Ireland for high impact investments, with a specific interest in semiconductors. Prior … Read More


A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon

A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon
by Daniel Nenni on 08-14-2026 at 8:00 am

A 0.42 Nanometer Breakthrough Could Push Transistors Beyond Silicon

Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.

Silicon transistors are approaching physical limits that make each new generation… Read More


ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution

ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution
by Daniel Nenni on 08-14-2026 at 6:00 am

ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution

ASML’s dominance was not born from a single invention. It emerged from four decades of systems engineering, supplier orchestration, and repeated bets on lithographic transitions that competitors judged too expensive. Founded in 1984 as a Philips–ASM joint venture, the Dutch company first differentiated itself with modular… Read More


Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes

Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
by Daniel Nenni on 08-13-2026 at 2:00 pm

Bronco AI Webinar SemiWiki

A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.

Bronco … Read More


Tuple Technologies at DAC 2026

Tuple Technologies at DAC 2026
by Daniel Payne on 08-13-2026 at 10:00 am

Team TupleTech DAC26

At #DAC2026 I met with Vamshi Kothur at Tuple Technologies to see how their cloud infrastructure products help IC design teams get their chip designs to market more quickly without the overhead of big IT and CAD teams. Tuple was founded in 2017 and has grown to about 45 people, headquartered in New Jersey. The challenge of using complex… Read More


Using Claude AI for Chip Design

Using Claude AI for Chip Design
by Daniel Nenni on 08-13-2026 at 6:00 am

Using Claude AI for Chip Design

After speaking with dozens of semiconductor professionals at the Design Automation Conference in Long Beach about AI in the chip-design workflow, Claude emerged as the common denominator in every conversation. We’re still at the tip of the iceberg when it comes to using AI in the design flow. If management is pushing your team … Read More


Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion

Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion
by Daniel Nenni on 08-12-2026 at 2:00 pm

Micron Advanced Memory Portfolio Positioned for AI Infrastructure Expansion

Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More


Comparing Intel EMIB and Intel Foveros

Comparing Intel EMIB and Intel Foveros
by Daniel Nenni on 08-12-2026 at 10:00 am

Comparing Intel EMIB and Intel Foveros SemiWiki

Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More


Boost Front-End SoC Design With Defacto’s AI-Powered Tool

Boost Front-End SoC Design With Defacto’s AI-Powered Tool
by Admin on 08-12-2026 at 6:00 am

Picture AI webinar blog

Front-end SoC design has always been a balancing act between speed, accuracy, and the large amount of manual work required to get RTL, IPs, and collaterals to be aligned. In a recent webinar, Defacto CEO and founder Chouki Aktouf joined by product manager Valentin Boyer, walked through how the company is bringing AI directly into… Read More


Temperature Does Not Only Age Hardware — It Moves the System

Temperature Does Not Only Age Hardware — It Moves the System
by Moh Kolb on 08-11-2026 at 2:00 pm

Temp not age HW Moves ys semiAug2

Temperature is often treated as a reliability clock.

Increase the temperature, accelerate the failure mechanism, and estimate the equivalent field life.

That approach can be useful—but only when the dominant failure mechanism is known, its thermal activation behavior is understood, and the same mechanism remains active … Read More