DAC 2026: How Undo Makes AI for Chip Design Work BetterDAC was abuzz this year with new AI-fueled…Read More
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CEO Interview with Brendan Emery of iQ SenseBrendan Emery is Co-Founder and Chief Executive Officer…Read More
Intel and TSMC Take Different Paths to High-NA EUVIntel and TSMC are pursuing the same objective—manufacturing…Read More
ASML’s dominance was not born from a single invention. It emerged from four decades of systems engineering, supplier orchestration, and repeated bets on lithographic transitions that competitors judged too expensive. Founded in 1984 as a Philips–ASM joint venture, the Dutch company first differentiated itself with modular… Read More
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
At #DAC2026 I met with Vamshi Kothur at Tuple Technologies to see how their cloud infrastructure products help IC design teams get their chip designs to market more quickly without the overhead of big IT and CAD teams. Tuple was founded in 2017 and has grown to about 45 people, headquartered in New Jersey. The challenge of using complex… Read More
After speaking with dozens of semiconductor professionals at the Design Automation Conference in Long Beach about AI in the chip-design workflow, Claude emerged as the common denominator in every conversation. We’re still at the tip of the iceberg when it comes to using AI in the design flow. If management is pushing your team … Read More
Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More
Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More
Front-end SoC design has always been a balancing act between speed, accuracy, and the large amount of manual work required to get RTL, IPs, and collaterals to be aligned. In a recent webinar, Defacto CEO and founder Chouki Aktouf joined by product manager Valentin Boyer, walked through how the company is bringing AI directly into… Read More
Temperature is often treated as a reliability clock.
Increase the temperature, accelerate the failure mechanism, and estimate the equivalent field life.
That approach can be useful—but only when the dominant failure mechanism is known, its thermal activation behavior is understood, and the same mechanism remains active … Read More
Siemens has EDA tools and flows, NVIDIA has AI infrastructure, so what happens when these two companies collaborate? I’m at DAC 2026 and all the buzz this year is Agentic AI, so an came out on Sunday evening about how semiconductor and PCB design flows are being improved by this teamwork. Amit Gupta from Siemens and Timothy Costa from… Read More
There were many new agentic design flows introduced at DAC this year. Some from mainstream providers and others from new startups. The increased level of activity around this technology was good to see. Most of the approaches presented at the conference were targeting specific parts of the flow. Verification and debug were popular… Read More
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ASML’s Path to Lithography Dominance—and the Coming Maskless Revolution