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PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026

PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
by Daniel Nenni on 05-19-2026 at 10:00 am

As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More


Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)

Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)
by Moh Kolb on 05-19-2026 at 8:00 am

PictureGFL

The semiconductor industry has achieved extraordinary mastery in silicon signoff. Modern EDA environments can now optimize timing closure, physical verification, IR/EM behavior, routing density, thermal interaction, and increasingly even design-space exploration through AI-assisted implementation flows. Crossing… Read More


imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling

imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
by Daniel Nenni on 05-19-2026 at 6:00 am

TSMC 3DFabric Alliance Expansion Signals New Era of System Level Scaling

imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More


Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting

Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting
by Admin on 05-18-2026 at 10:00 am

Crossing the Yield Cliff IDP V6 and the Future of Manufacturing Forecasting

The paper, Industrial Defectivity Prediction (IDP) V6: A Two-Layer Yield Cliff Framework for Cross-Industry Mass-Production Forecasting, presents a generalized industrial yield-modeling architecture that extends the classical Negative Binomial framework through a two-layer phenomenological structure designed … Read More


From the Selfie to Samantha: The Next Trillion-Dollar Behavior

From the Selfie to Samantha: The Next Trillion-Dollar Behavior
by Jonah McLeod on 05-18-2026 at 8:00 am

Yuning Jonah

At CES 2026, Samsung called it a “companion.” Lenovo called it “ambient intelligence.” OpenAI spent $6.4 billion on a screenless device designed to be a continuous presence in your pocket. Meta acquired Limitless, the AI pendant that had been tracking everything its wearers said and heard. Every major consumer electronics company… Read More


AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
by Daniel Nenni on 05-18-2026 at 6:00 am

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More


CEO Interview with RP Singh of Seasia Infotech

CEO Interview with RP Singh of Seasia Infotech
by Daniel Nenni on 05-17-2026 at 2:00 pm

RP Singh Photo (1)

Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More


CEO Interview with Adi Gelvan of Speedata

CEO Interview with Adi Gelvan of Speedata
by Daniel Nenni on 05-17-2026 at 12:00 pm

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Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 Read More


Podcast EP346: How EMD Electronics Bridges the “Lab to Fab” Gap With Ganesh Panaman

Podcast EP346: How EMD Electronics Bridges the “Lab to Fab” Gap With Ganesh Panaman
by Daniel Nenni on 05-15-2026 at 10:00 am

Daniel is joined by Ganesh Panaman, the President of Intermolecular Services at EMD Electronics. In his current role, Ganesh is dedicated to accelerating product time-to-market, securing first-mover advantages on disruptive technologies, and actively engaging with the dynamic startup ecosystem in the Silicon Valley. … Read More


TSMC’s Record Tool Orders Hint at Another CapEx Shockwave

TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
by Daniel Nenni on 05-15-2026 at 8:00 am

TSMC’s Record Tool Orders Hint at Another CapEx Shockwave 2026

TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More