The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More
SEMICON West’s “Bridging design and Manufacturing with AI” Design Session Explores AI as Practical Lever Across Entire LifecycleBy Julie Rogers, Executive Director, Electronic System Design…Read MoreLLM-assisted schematic test-report analysis and root-cause investigation
By Piyush Bag
Intro: In this AI era, building data centers has become crucial not just for hyperscalers, but for many companies as well, as they build the infrastructure for AI. At a high level, a data center includes compute, storage, networking, and other infrastructure. This article is about the design lifecycle of network hardware.… Read More
From Frontend to the Frontiers of Silicon with Moores Lab AI
Synopsys Announces AgentEngineer Solutions and Autopilot Platform for Autonomous Engineering
Synopsys today announced its AgentEngineerTM solutions portfolio and AutopilotTM Platform, advancing a fundamental paradigm shift in electronic design automation (EDA): moving beyond AI copilots toward autonomous engineering agents. Following a recent technical briefing with Thomas Andersen, Vice President of AI and… Read More
PDF Solutions CONNECT, the Premier Event for Semiconductor Analytics and AI, October 15 and 16 in San Francisco
On October 15 and 16, 2026, in San Francisco, PDF Solutions will hold PDF Solutions CONNECT, the premier event for Semiconductor Analytics and AI. This event starts at the end of SEMICON WEST 2026 in a location in close proximity to the Moscone Center. It is a great opportunity for leading semiconductor and equipment companies attending… Read More
CEO Interview with Vivek Raghuraman of Mixx Technologies
Vivek Raghuraman is co-founder and CEO of Mixx Technologies. At Intel, he led the first integrated silicon photonics transceiver to commercial release. At Broadcom, Raghuraman took two commercial generations of co-packaged optics through hyperscaler qualification in Meta’s environment. In 2023, together with Rebecca … Read More
CEO Interview with Dr. Stefan Pastine of Thintronics
Stefan Pastine PhD is an American chemist and entrepreneur. In 2011, he founded Connora Technologies, developer of Recyclamine, a recyclable epoxy thermoset technology that allows carbon fiber, fiberglass, and aramid fiber to be recovered from composite waste. Aditya Birla Chemicals acquired Connora in 2019 and applied … Read More
CEO Interview With Nick Kurayev of ScienceSoft
Nick Kuraye is the CEO of ScienceSoft, an AI transformation and software development company focused on regulated industries such as healthcare, insurance, and investment. The company has been in the market since 1989, delivering AI software solutions and supporting AI hardware implementation.
I spoke with Nick about how … Read More
Podcast EP369: How Aion Silicon Enables Next Generation Innovation with Oliver Jones
Daniel is joined by Oliver Jones, CEO of Aion Silicon, a global semiconductor design and engineering company delivering custom silicon solutions for the AI age. He leads the company’s strategy and growth as it continuously helps technology companies bring advanced SoC designs to market from architecture through production,… Read More
Designing chips for the AI era: what TSMC’s roadmap means
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More



Why ASML Is Racing to Build 110 EUV Machines