Dr. Y.J. Mii WIki

Dr. Yuh-Jier (Y.J.) Mii (米玉傑)

Title:

Executive Vice President and General Manager of R&D
Head of TSMC’s Advanced Technology Development

Dr. Y.J. Mii is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company’s R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016.

In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, 3nm, and beyond, he has helped maintain TSMC’s technology leadership in the foundry segment of the global semiconductor industry.

Dr. Mii received the IEEE Frederik Philips Award in 2022, recognizing his outstanding accomplishments in the management of research and development. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center.

Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).

Summary

Dr. Y.J. Mii is one of the most influential technologists at Taiwan Semiconductor Manufacturing Company (TSMC). He leads the development of TSMC’s most advanced semiconductor process technologies, including EUV lithography, gate-all-around (GAA) transistors, and backside power delivery. Often referred to as the architect behind TSMC N3, N2, and A-series nodes, Mii plays a critical role in maintaining TSMC’s technology leadership over global competitors such as Intel and Samsung.

Known for his low-profile but high-impact leadership style, Dr. Mii is deeply respected for his technical rigor, long-term vision, and ability to deliver on complex manufacturing challenges.

Career at TSMC

Year	Role	Milestone
~1990s–2000s	Joined TSMC R&D	Worked on early FinFET and logic scaling
2013–2018	VP of R&D	Oversaw N7 and N5 development
2018–2021	SVP, Advanced Technology	Delivered N3 and EUV deployment
2022–2025	EVP and GM, R&D	Led N2 (GAA) and A16, A14 nodes

Technical Contributions

Extreme Ultraviolet Lithography (EUV): Spearheaded EUV insertion at N7+ and full EUV adoption at N5.
Gate-All-Around Nanosheet Transistors: Architect of TSMC’s N2 node with stacked nanosheets and backside power.
TSMC A-Series: Driving system-level power and performance innovation beyond traditional transistor scaling.
TSMC 3DFabric: Collaborating closely on integration with advanced packaging and chiplet technologies.

Notable Quotes from Dr. Y.J. Mii

“With each generation, it becomes harder to scale — but not impossible.”

“EUV is not just a lithography tool. It’s a fundamental enabler of advanced logic nodes.”

“We design for manufacturability from day one — it’s not just about physics, but economics.”

“Gate-All-Around is not the end. It is the beginning of a new system-centric era.”

“TSMC is not just delivering transistors — we are enabling platforms for the AI and 5G era.”

“Backside power delivery is a game changer, but it requires rethinking everything from metal layers to power integrity.”

“What matters is not being first, but being right — at scale, with yield, and for customers.”

Leadership Style

Trait	Description
Technical First	Deep involvement in device physics and integration challenges
Execution-Oriented	Known for delivering nodes on schedule and in volume
Low-Profile	Rarely speaks publicly, but highly respected inside the industry
Collaborative	Works closely with EDA partners and fabless design houses

Recognition and Industry Impact

Often cited as TSMC’s technical brain behind its logic scaling roadmap.
Frequently mentioned in industry keynotes and technical panels, especially regarding EUV and GAA.
Seen as a possible future TSMC CTO or President in a post-C.C. Wei leadership era.

Legacy

Dr. Mii’s contributions have been central to TSMC’s sustained process leadership. His work has enabled the company to deliver consistent node advancements from 7nm to 2nm and beyond, helping customers such as Apple, AMD, Nvidia, and Qualcomm bring cutting-edge chips to market. As TSMC enters the Angstrom era, Dr. Mii remains one of the most critical figures behind the scenes.