Wiki Tag: SoIC
CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More
TSMC 3D Fabric™ Wiki
TSMC 3D Fabric™ is a comprehensive suite of 3D silicon stacking and advanced packaging technologies developed by Taiwan Semiconductor Manufacturing Company (TSMC) to enable high-performance, power-efficient, and space-optimized system integration. It represents TSMC’s response to growing industry demand for heterogeneous… Read More
TSMC Open Innovation Platform Wiki
The TSMC Open Innovation Platform® (OIP) is TSMC’s design-enablement ecosystem and infrastructure. It brings together process technology, PDKs, reference flows, certified EDA tools, silicon-proven IP, design services, cloud enablement, and advanced packaging under a coordinated program to reduce design barriers, speed… Read More
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