Wiki Tag: Silicon Interposer
CoPos (Chip-on-Panel-on-Substrate) Wiki
Chip-on-Panel-on-Substrate (CoPoS) is an advanced packaging architecture that “panelizes” the classic chip-on-carrier flow. Instead of building redistribution and interposer structures on round wafers, CoPoS forms them on large rectangular panels, then mounts the finished module onto an organic or glass package substrate.… Read More
High Bandwidth Memory (HBM) Wiki
Overview
High Bandwidth Memory (HBM) is a high-performance RAM interface designed to deliver extremely wide I/O and low power consumption. It is primarily used in high-end GPUs, AI accelerators, supercomputers, and advanced FPGAs. HBM achieves high memory bandwidth by stacking multiple DRAM dies vertically and connecting… Read More
Can RISC-V Help Recast the DPU Race?