Wiki Tag: Intel Foveros
Samsung X-Cube™ (eXtended-Cube)
Samsung X-Cube™ is a 3D IC packaging technology developed by Samsung Electronics that enables vertical stacking of multiple active logic dies using through-silicon vias (TSVs) and micro-bump bonding. As part of Samsung’s Advanced Package (AVP) portfolio—which also includes I-Cube™ (2.5D interposer-based packaging) and… Read More
Intel Foveros Wiki
Foveros is a 3D chip stacking technology developed by Intel that enables high-density vertical integration of multiple active logic dies using face-to-face (F2F) hybrid bonding and through-silicon vias (TSVs). First unveiled in December 2018, Foveros allows for heterogeneous integration of compute, graphics, AI, and IO… Read More
IC Packaging Comparison Wiki (TSMC, Intel, Samsung)
Why advanced packaging matters:
As Moore’s Law slows down, it has become increasingly difficult and expensive to scale monolithic SoCs. This has driven the semiconductor industry toward heterogeneous integration, which combines different functional blocks (CPU, GPU, memory, accelerators, etc.) in a single package… Read More
Can RISC-V Help Recast the DPU Race?