Wiki Tag: 3D Die Stacking
Intel Foveros Wiki
Foveros is a 3D chip stacking technology developed by Intel that enables high-density vertical integration of multiple active logic dies using face-to-face (F2F) hybrid bonding and through-silicon vias (TSVs). First unveiled in December 2018, Foveros allows for heterogeneous integration of compute, graphics, AI, and IO… Read More
Basilisk at Hot Chips 2025 Presented Ominous Challenge to IP/EDA Status Quo