This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification.
Designing functionally correct, high-performance, and provably secure system-on-chips (SoCs) has become a strategic imperative for modern computing infrastructure. Yet traditional… Read More
Featured Speakers:
- Jerome Toublanc, Product Management, Principal, Synopsys
As advanced-node and multi-die designs push power delivery networks to their limits, accurately understanding voltage behavior has become essential for both signoff confidence and design optimization. Traditional approaches often struggle… Read More
Why Your Impedance Models May Be Less Accurate Than You Think
For many years, the PCB industry has accepted dielectric values without fully understanding how they were measured—or whether they’re the right values for impedance modeling. This webinar explores what that means for today’s high-speed designs.
As … Read More
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something… Read More
IC Packaging Technologyby Admin on 07-06-2026 at 7:14 pm
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal… Read More