As 1.6T Ethernet moves from concept to deployment, validating interconnects is more critical — and complex — than ever. But the challenge demands more than just speed — it’s proving performance in real-world conditions. Traditional test methods are slow and require manual intervention — adding complexity, longer development
6G is transforming wireless networks from a channel for communication into a powerful tool for sensing the world around us. Beyond connecting people and devices, 6G opens the door to applications such as gesture recognition, object detection, and location awareness — capabilities that demand new approaches to modeling, simulation,
NTNs extend coverage everywhere; 6G delivers the tools to optimize, scale, and seamlessly integrate them.
Join our expert roundtable for a high-impact discussion on today’s NTN landscape. Discover how 6G will accelerate their evolution. Learn about the engineering challenges and opportunities shaping the future. You’ll
AI and machine learning (AI/ML) are reshaping wireless communications, promising faster, more efficient, and more intelligent networks. But bringing these algorithms into real-world environments isn’t simple — validation and testing remain major hurdles.
In this webinar, industry expert Abhinav Mahadevan shares how
Join Roger Nichols, 6G Program Manager, for an insightful discussion on the 6G spectrum. He will cover the current status of 6G technologies, standards, and policies for the next generation of wireless, including developments from 2024 after the World Radio Conference.
This webinar
Join us for this essential webinar where we’ll explore how Questa One Sim empowers VHDL designers to dramatically enhance their debugging productivity. We’ll move beyond basic simulation viewing and dive into advanced features designed to pinpoint issues faster, understand design behavior more intuitively,
High-Level Synthesis (HLS) is design flow in which design intent is described at a higher level of abstraction such as SystemC/C++/Matlab/etc. HLS tools are expected to synthesize this code to RTL which can be input to the traditional RTL downstream flow (RTL/GDS).
Formal check tools are difficult to be analyzed on generated
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep
This webinar provides an in-depth discussion about the challenges posed by AI’s increasing power requirements to voltage regulation, more specifically physical limitations such as power distribution losses, thermal and cooling limitations, and power density issues.
It then explores innovative technologies designed
The importance of second-stage optimization in power delivery for data centers and high-performance computing cannot be overstated. With the potential to increase energy efficiency from an average of 85% to approximately 90%,
Infineon is at the forefront of developing innovative solutions to meet the rapidly growing demands
