Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More