Lithography For Advanced Packaging Equipment

Lithography For Advanced Packaging Equipment
by Robert Castellano on 06-24-2019 at 10:00 am

Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


SPIE Advanced Lithography Conference 2019 Overall Impressions

SPIE Advanced Lithography Conference 2019 Overall Impressions
by Scotten Jones on 03-05-2019 at 6:00 am

Last week I attended the 2019 SPIE Advanced Lithography Conference. I gave two presentations, attended dozens of papers and conducted three interviews. I will be doing some detailed write ups particularly on EUV but I am waiting for the presentations from several of the papers. In the mean time I thought I would put some overall … Read More


Diversity of chip segments had tempered downturns but no more?

Diversity of chip segments had tempered downturns but no more?
by Robert Maire on 10-29-2015 at 12:00 pm

Image Removed* The Current Downturn is more Broadly Based…
* Back to the “bad old days” of Lemmings off a cliff???
* Its not just a Foundry thing…
* All corners of the chip industry are impacted!!!Read More