Chiplets Open Pandora’s Box

Chiplets Open Pandora’s Box
by Daniel Nenni on 01-31-2024 at 6:00 am

Chiplet

Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More


Alphawave Semiconductor Powering Progress

Alphawave Semiconductor Powering Progress
by Daniel Nenni on 01-03-2024 at 6:00 am

Alphawave Semiconductor Chiplets

Do you know who had another great year? Alphawave Semi did. Despite being relatively young in the industry (founded in 2017), the company has quickly gained recognition for its advancements in high-speed connectivity solutions.

They specialize in developing high-speed connectivity solutions for Data centre, AI, 5G wireless… Read More


Will Chiplet Adoption Mimic IP Adoption?

Will Chiplet Adoption Mimic IP Adoption?
by Eric Esteve on 12-28-2023 at 6:00 am

Adoption theory

If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More


Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure

Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
by Kalar Rajendiran on 12-19-2023 at 6:00 am

Alphawave Semi 224G SerDes 1st TestChip

In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More


UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem

UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
by Kalar Rajendiran on 12-11-2023 at 6:00 am

Pike Creek UCIe Test chip

Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More


Keysight EDA 2024 Delivers Shift Left for Chiplet and PDK Workflows

Keysight EDA 2024 Delivers Shift Left for Chiplet and PDK Workflows
by Don Dingee on 09-28-2023 at 8:00 am

Chiplet PHY Designer

Much of the recent Keysight EDA 2024 announcement focuses on high-speed digital (HSD) and RF EDA features for Advanced Design System (ADS) and SystemVue users, including RF System Explorer, DPD Explorer (for digital pre-distortion), and design elements for 5G NTN, DVB-S2X, and satcom phased array applications. Two important… Read More


Alphawave Semi Visit at #60DAC

Alphawave Semi Visit at #60DAC
by Daniel Payne on 08-03-2023 at 10:00 am

Alphawavesemi, DAC 2023 3nm eye diagram

On Wednesday at #60DAC I met Sudhir Mallya, Sr. VP Corporate Marketing at Alphawave Semi to get an update about what’s been happening at their IP company and with industry trends. The tagline for their company is: Accelerating the Connected World; and they have IP for connectivity, offer chiplet solutions, and even provide… Read More


Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint

Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint
by Kalar Rajendiran on 06-20-2023 at 6:00 am

Synopsys Samsung silicon wafer

Many credible market analysis firms are predicting the semiconductor market to reach the trillion dollar mark over the next six years or so. Just compare this to the more than six decades it took for the market to cross the $500 billion mark. The projected growth rate is incredible indeed and is driven by fast growing market segments… Read More


Chiplet Interconnect Challenges and Standards

Chiplet Interconnect Challenges and Standards
by Daniel Payne on 05-25-2023 at 10:00 am

Multi die IP min

For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More


The Rise of the Chiplet

The Rise of the Chiplet
by Kalar Rajendiran on 03-28-2023 at 10:00 am

Open Chiplet Economy

The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More