Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Wendy Chen, MBA from the University of Manchester, has been the Founder and CEO of MSquare Technology since 2021. With over 23 years in the semiconductor industry, Wendy’s career includes roles as Sales Director at Synopsys Technology, Vice President at TF-AMD, and Vice President at Alchip Asia Pacific. Her extensive experience… Read More
The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
At #61DAC, I love it when an exhibitor booth uses a descriptive tagline to explain what they do, like when the Blue Cheetah booth displayed Advancing Chiplet Interconnectivity. Immediately, I knew that they were an IP provider focusing on chiplets. I learned what sets them apart is how customizable their IP is to support specific… Read More
Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year. Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More
Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More
The multi-die chiplet-based revolution is upon us. The ecosystem will need to develop various standards and enabling IP to make the “mix and max” concept a reality. UCIe, or Universal Chip Interconnect express is an open, multi-protocol on-package die-to-die interconnect and protocol standard that promises to pave the way … Read More
