How ST-Ericsson Improved DFM Closure using SmartFill

How ST-Ericsson Improved DFM Closure using SmartFill
by Daniel Payne on 10-07-2011 at 2:38 pm

DFM closure is a growing issue these days even at the 45nm node, and IC designers at ST-Ericsson have learned that transitioning from dummy fill to SmartFill has saved them time and improved their DFM score.

The SOC
ST-Ericsson designed an SOC for mobile platforms called the U8500 and their foundry choice was a 45nm node at STMicroelectronicsRead More