A significant shift is underway in the fabless semiconductor business model. As the application markets have become more diverse (and more cost-sensitive), product requirements have necessitated a new focus on multi-die packaging technology. … Read More
Tag: tim
Predicting Component Temperature Early in Design
In today’s electronics with multiple functions working together, heat generation is on the rise; sometimes it becomes intolerable. In fact components running at different temperatures can cause timing issues, and very high temperatures can lead to operational issues such as latch-up. An electronic system can contain chips,… Read More