Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop
February 25, 2020
11:00 AM – 12:00 PM (EST)
Venue: Online
Join us to learn about the new capabilities available for thermal analysis within ANSYS Electronics Desktop in 2020 R1. The latest release includes powerful new features for the design of electronics cooling strategies and electrothermal analysis. New features… Read More
