CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs
by Admin on 06-01-2022 at 3:00 pm

 

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop

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ANSYS 2020 R1– Thermal Integrity Update

ANSYS 2020 R1– Thermal Integrity Update
by Admin on 01-07-2020 at 2:14 pm

February 25, 2020

11:00 AM – 12:00 PM (EST)

Venue: Online

Join us to learn about the new capabilities available for thermal analysis within ANSYS Electronics Desktop in 2020 R1. The latest release includes powerful new features for the design of electronics cooling strategies and electrothermal analysis. New features… Read More