On October 15–16, at the tail end of SEMICON West 2026, PDF Solutions held its 2026 CONNECT Conference at the Westin St. Francis in San Francisco.
PDF Solutions Vitals
Santa Clara–based PDF Solutions is a semiconductor data, analytics, and connectivity company, founded in 1991. Today, its business rests on three pillars, all … Read More
Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More
Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More
TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures
TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures
TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures
TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
* The Current Downturn is more Broadly Based…
* Back to the “bad old days” of Lemmings off a cliff???
* Its not just a Foundry thing…
* All corners of the chip industry are impacted!!!… Read More
