The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation

The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
by Kalar Rajendiran on 08-15-2024 at 6:00 am

Comparative Analysis of Chiplet Interconnect Standards (Physical Layer)

The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More


IoT begets silicon, interoperability, and standards

IoT begets silicon, interoperability, and standards
by Don Dingee on 11-19-2013 at 5:00 pm

The Internet of Things is on every technology mind these days, but what does it mean for the EDA community? Dennis Brophy of Mentor Graphics says the billions of things we are hearing about will not happen unless we find a way to build a lot more things, efficient things, and connected things. He has more thoughts in our recent interview.… Read More