Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.
The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More
Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
The TSMC Open Innovation Platform (OIP) Ecosystem Forum kicked off on September 24 in Santa Clara, CA. This is the event where TSMC recognizes and promotes the vast ecosystem the company has created. After watching this effort grow over the years, I feel that there is nothing the group can’t accomplish thanks to the alignment and… Read More
The world is buzzing with 5G deployment news. It seems the entire planet anxiously awaits the step function improvement in bandwidth and latency promised by this new technology. When there is additional deployment, it’s news. When there are new chipsets and devices supporting the standard it’s news. But when there is a fundamental… Read More
Compute environments have advanced significantly over the past several years. Microprocessors have gotten faster by including more cores, available RAM has increased significantly, and the cloud has made massive distributed computing more easily and cheaply available.
HFSS has evolved to take advantage of these new capabilities,… Read More
In early 2000s, semiconductor design at RTL level was gaining momentum. The idea was to process more design steps such as insertion of test and other design structures upfront at the RTL level. The design optimization and verification were to be done at the RTL level to reduce long iterations through gate level design because changes… Read More
