Full-chip Multi-domain ESD Verification

Full-chip Multi-domain ESD Verification
by Paul McLellan on 03-27-2015 at 7:00 am

ESD stands for electro-static discharge and deals with the fact that chips have to survive in an electrically hostile environment: people, testers, assembly equipment, shipping tubes. All of these can carry electric charge that has the “potential” (ho-ho) to damage the chip irreversibly. Historically this was… Read More


Analyzing Power Nets Early and Often, a New White Paper

Analyzing Power Nets Early and Often, a New White Paper
by Paul McLellan on 02-22-2015 at 7:00 am

One of the big challenges in designing ICs today is designing a robust power net capable of delivering necessary current levels to all areas of the die. Getting it wrong can, of course, lead to circuit failures that range from non-functional silicon, through intermittent performance and functional problems, to early EM-driven… Read More


Analyzing Power Nets

Analyzing Power Nets
by Paul McLellan on 01-21-2015 at 7:00 am

One of the big challenges in a modern SoC is doing an accurate analysis of the power nets. Different layers of metal have very different resistance characteristics (since they vary so much in width and height). Even vias can cause problems due to high resistance. Typically power is distributed globally on high-level metal layers,… Read More


A Brief History of Silicon Frontline

A Brief History of Silicon Frontline
by Paul McLellan on 12-19-2014 at 7:00 am

Silicon Frontline was founded in 2007 by Yuri Feinberg. Since then the company has built up a team with expertise in computational geometry, circuit layout, circuit simulation and analysis, and post-layout verification. After a small initial funding, Silicon Frontline has continued to grow, acquiring new customers even over… Read More


A 3D Field Solver for Parasitic Extraction Thermal ESD Analysis

A 3D Field Solver for Parasitic Extraction Thermal ESD Analysis
by Daniel Payne on 06-27-2013 at 2:38 pm

The smaller the process node the more necessary it is that you extract accurate parasitics from interconnect and 3D structures in order to analyze timing, thermal effects and ESD compliance. Silicon Frontlinehas EDA tools in all three of these categories, so I met with Dermott Lynchat DAC to get an annual update.


Dermott Lynch,Read More


Why X-Fab uses 3D Resistance Extraction and Analysis

Why X-Fab uses 3D Resistance Extraction and Analysis
by Daniel Payne on 02-09-2012 at 11:18 am

At DAC in 2011 I visited an EDA company called Silicon Frontline Technology because they offered some 3D field solver tools used to create the highest accuracy netlists that can then be simulated with a SPICE circuit simulator to predict timing, power and IR drop. A recent press release with X-FAB and Silicon Frontline looked interesting… Read More


A New Hierarchical 3D Field Solver

A New Hierarchical 3D Field Solver
by Daniel Payne on 05-19-2011 at 2:04 pm

Introduction
3D field solvers produce the most accurate netlists of RC values of your IC layout that can then be used in SPICE circuit simulators however most of these solvers produce a flat netlist which tends to simulate rather slowly. Thankfully several years ago the first hierarchical SPICE tools were offered by Nassda (HSIMRead More