3DIC Verification Methodologies for Advanced Semiconductor ICs

3DIC Verification Methodologies for Advanced Semiconductor ICs
by Kalar Rajendiran on 06-06-2024 at 10:00 am

3DIC Flow Challenges

At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.

3DIC Challenges

Despite the numerous advantages of 3DIC technology, its… Read More


Reliability Analysis for Mission-Critical IC design

Reliability Analysis for Mission-Critical IC design
by Daniel Payne on 09-13-2021 at 10:00 am

reliability analysis min

Mission-critical IC design for segments like automotive, aerospace, defense, medical and 5G have more stringent reliability analysis requirements than consumer electronics, and entails running special simulations for the following concerns:

  • Electromigration analysis
  • IR drop analysis
  • MOS aging
  • High-sigma Monte Carlo
Read More

Approaches for EM, IR and Thermal Analysis of ICs

Approaches for EM, IR and Thermal Analysis of ICs
by Daniel Payne on 04-26-2017 at 12:10 pm

As an engineer I’ve learned how to trade off using various EDA tools based on the accuracy requirements and the time available to complete a project. EDA vendors have been offering software tools to help us with reliability concerns like EM, IR drop and thermal analysis for several years now. Last week I attended a webinar … Read More