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At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.
3DIC Challenges
Despite the numerous advantages of 3DIC technology, its… Read More
Mission-critical IC design for segments like automotive, aerospace, defense, medical and 5G have more stringent reliability analysis requirements than consumer electronics, and entails running special simulations for the following concerns:
- Electromigration analysis
- IR drop analysis
- MOS aging
- High-sigma Monte Carlo
…
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As an engineer I’ve learned how to trade off using various EDA tools based on the accuracy requirements and the time available to complete a project. EDA vendors have been offering software tools to help us with reliability concerns like EM, IR drop and thermal analysis for several years now. Last week I attended a webinar … Read More