MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear… Read More
The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in … Read More
Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More
We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.
My curiosity kicked in when I looked at the recent press release… Read More
