The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
Podcast EP241: A Look at Agile Analog IP with Chris Morrison
Dan is joined by Chris Morrison, who has over 15 years of experience in delivering innovative analog, digital, power management and audio solutions for International electronics companies, and developing strong relationships with key partners across the semiconductor industry. Currently he is the Director of Product Marketing… Read More