Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


Crosstalk, 2kAmp power delivery, PAM4, and LPDDR5 analysis at DesignCon

Crosstalk, 2kAmp power delivery, PAM4, and LPDDR5 analysis at DesignCon
by Don Dingee on 01-24-2025 at 8:00 am

Old way of crosstalk analysis

High-speed digital (HSD) designers have long tested the limits of realizable speed. GHz frequencies are now the norm, and multi-level signaling is pushing rates higher while the long-awaited transition to optical signaling and even higher rates looms ever closer. Power density is also climbing, and data-hungry applications… Read More


Acquiring Great Power

Acquiring Great Power
by Paul McLellan on 01-20-2012 at 5:11 pm

“Before we acquire great power we must acquire wisdom to use it well”
Ralph Waldo Emerson

Making good architectural decisions for controlling power consumption and ensuring power integrity requires a good analysis of the current requirements and how they vary. Low power designs, and today there really aren’t… Read More