The cost of an IC depends on many factors like: NRE, masks, fabrication, testing, packaging. Product engineers are tasked with testing each part and understanding what exactly is limiting the yields. Every company has a methodology for Physical Failure Analysis (PFA), and the challenge is to make this process as quick as possible,… Read More
Yesterday at SEMICON West I attended an interesting talk about how to use the masses of die test data to improve silicon yield. The speaker was Dr. Martin Keim, from Mentor Graphics.
First of all, he pointed out that with advanced process nodes (45nm, 32nm, and 28nm), and new technologies like FinFETs, we get design-sensitive defects.… Read More