Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die. At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”. The key takeaway messages… Read More
Product Qualification Overview
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability … Read More