How to meet 3Ps in 3D-ICs with sub-20nm Dies?

How to meet 3Ps in 3D-ICs with sub-20nm Dies?
by Pawan Fangaria on 03-06-2014 at 1:30 am

It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More


How to Multi-Voltage IC Design in 10 Easy Steps

How to Multi-Voltage IC Design in 10 Easy Steps
by glforte on 10-14-2010 at 4:14 pm

What I’m really describing here is an over-simplified backend flow for physical design of low power ICs with multiple voltage domains. If you haven’t ventured into this territory yet, this will hopefully give you some food for thought. Here are the basic steps:… Read More


How to Multi-Voltage IC Design in 10 Easy Steps

How to Multi-Voltage IC Design in 10 Easy Steps
by glforte on 10-14-2010 at 4:14 pm

What I’m really describing here is an over-simplified backend flow for physical design of low power ICs with multiple voltage domains. If you haven’t ventured into this territory yet, this will hopefully give you some food for thought. Here are the basic steps:… Read More