The week before DAC I had the privilege to take a video call with Pradeep Thiagarajan – Product Manager, Simulation, Custom IC Verification at Siemens EDA to get an update on new simulation products. I’ve been following Solido for years now and knew that they were an early adopter of ML for Monte Carlo simulations with SPICE users.… Read More
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
I’ve been following the EM/IR (Electro-Migration, IR is current and resistance) analysis market for many years now, and recently attended a presentation from Steven Chin, Sr. Director IC Engineering of Efinix, at the User2User event organized by Siemens EDA. The Tuesday presentation was in the morning at the Marriott… Read More
My first IR drop analysis was back in the early 1980s at Intel, where I had to manually model the parasitics of the VDD and VSS interconnect for all of the IO cells that our team was designing in a graphics chip, then I ran that netlist in a SPICE simulator using transient analysis, measuring the bounce in VSS and droop in VDD levels as all… Read More
