SmartScan Addresses Test Challenges of SoCs

SmartScan Addresses Test Challenges of SoCs
by Pawan Fangaria on 09-04-2014 at 4:00 pm

With advancement of semiconductor technologies, ever increasing sizes of SoCs bank on higher densities of design rather than giving any leeway towards increasing chip area and package sizes; a phenomenon often overlooked. The result is – larger designs with lesser number of pins bonded out of ever shrinking package sizes;… Read More


Ceaseless Field Test for Safety Critical Devices

Ceaseless Field Test for Safety Critical Devices
by Pawan Fangaria on 06-03-2014 at 3:00 am

While focus of the semiconductor industry has shifted to DACin this week and unfortunately I couldn’t attend due to some of my management exams, in my spare time I was browsing through some of the webpages of Cadenceto check their new offerings (although they have a great list of items to showcase at DAC) and to my pleasure I came across… Read More


Highest Test Quality in Shortest Time – It’s Possible!

Highest Test Quality in Shortest Time – It’s Possible!
by Pawan Fangaria on 12-26-2013 at 10:30 am

Traditionally ATPG (Automatic Test Pattern Generation) and BIST (Built-In-Self-Test) are the two approaches for testing the whole semiconductor design squeezed on an IC; ATPG requires external test equipment and test vectors to test targeted faults, BIST circuit is implemented on chip along with the functional logic of IC.… Read More