In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed:
KLA saw its share of the semiconductor metrology/inspection market increase from 52% in 2018 to 56% in 2019.
As a background, KLA manufactures and sells equipment used to monitor many of the 400 to 600 processing steps in the manufacturing of semiconductors, starting with a bare wafer, such as silicon, to a completed device. The… Read More
On April 2 – 4, the 2019 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) will be held at the Monterey Marriott in Monterey, CA. The 2019 FCMN is the 12th in the series that began in 1995 with a keynote talk by Craig Barrett, ex-CEO of Intel.… Read More
ASML reported EUR2.78B in revenues with EUR2.08B in systems. 58% was for memory. EUV was EUR513M with 5 systems. Importantly orders were for EUR2.20B in systems at 64% memory and 5 EUV tools. This was likely better than expectations given the overall industry weakness. EPS of EUR1.60 was more or less in line with expectations. Guidance… Read More
MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear… Read More
