Road to Chiplets – Ecosystems 2023

Road to Chiplets – Ecosystems 2023
by Admin on 11-28-2023 at 3:24 pm

With heterogeneous integration (HI) and advanced packaging becoming the dominant drivers of progress in many electronic products, the need for collaboration and a robust ecosystem has grown. In the earlier days of Moore’s Law when the silicon node was the main metric and driver for advances in the semiconductor industry, the

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3D: the Backup Plan

3D: the Backup Plan
by Paul McLellan on 09-05-2013 at 1:20 pm

With the uncertainties around timing of 450mm wafers, EUV (whether it works at all and when) and new transistor architectures it is unclear whether Moore’s law as we know it is going to continue, and in particular whether the cost per transistor is going to remain economically attractive especially for consumer markets … Read More