Tag: Lang lin

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ML and Multiphysics Corral 3D and HBM

ML and Multiphysics Corral 3D and HBM
by Bernard Murphy on 01-07-2025 at 6:00 am
Categories: 3D IC, AI, Ansys, Inc., Chiplet, EDA

multidie and HBM stacks min

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More

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Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
by Daniel Nenni on 06-26-2023 at 10:00 am
Categories: Ansys, Inc., EDA, Events

dac 2023 600x100

 

Highlights:

  • Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
  • There will be technical presentations every hour in the Ansys Booth Theater (#1539)
  • Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
… Read More