In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.
JOHN BRUGGEMAN
By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the … Read More
Hard to believe EDA360, the Cadence Blueprint toBattle ‘Profitability Gap’; Counters Semiconductor Industry’s Greatest Threat!, is DEAD at the ripe old age of one. As you may have already read John Bruggeman left Cadence after the company conference call last week. The formal announcement should go out on Monday after the SEC… Read More
Hard to believe a year has gone by since the big announcement of the Cadence Blueprint toBattle ‘Profitability Gap’; Counters Semiconductor Industry’s Greatest Threat! Having spent more time on it that I should have, here is my opinion on EDA360 on its first anniversary.
Richard Georing did a very nice anniversary piece “Ten Key… Read More
Insanity is doing the same thing over and over again and expecting different results (Albert Einstein). Given that statement, according to John Bruggeman (Cadence CMO and EDA360 Chief Anarchist) the semiconductor industry is INSANE!
This year the EDA Tech Forum and the Global Semiconductor Alliance Expo were not only on the … Read More
“Cadence Design Systems, Inc. (NASDAQ: CDNS), the global leader in EDA360………”
Of course, why wouldn’t Cadence be the global leader in something they just made up? As a follow-up to my yawningly successful blog Cadence EDA360 Manifesto:
One of the problems I have with EDA360 is the fear, uncertainty, and doubt (FUD) it attempts … Read More
EDA360 is said to be a blueprint or high-level vision for the EDA industry and not a Cadence specific document, based on the challenges that customers are experiencing. What EDA36o really is, is a manifesto, a public declaration of intentions, opinions, objectives, or motives, issued by a specific organization. The question … Read More
