Webinar: Signal Integrity Issues for Silicon Interposers

Webinar: Signal Integrity Issues for Silicon Interposers
by Admin on 01-11-2023 at 2:58 pm

The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional design methodologies and flows. Designers of high-speed

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Webinar: Comprehensive Multiphysics Analysis Platform for 3D-IC Interposers

Webinar: Comprehensive Multiphysics Analysis Platform for 3D-IC Interposers
by Admin on 10-12-2022 at 2:13 pm

This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design.

TIME:

NOVEMBER 3, 2022

11 AM EDT / 3 PM GMT / 8:30 PM IST

REGISTER HERE

About this Webinar

This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs.

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2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!

2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!
by Bill Martin on 12-27-2015 at 4:00 pm

Last week I presented at the 3D ASIP EDA Tutorial and attended the Conference. In previous years, leading edge papers were presented from large companies pushing a solution to meet their needs. These companies had the resources and clout to achieve some astounding successes, but the lingering question was: “what other product… Read More


3D-IC: Embedded Passives

3D-IC: Embedded Passives
by Arabinda Das on 03-02-2015 at 1:00 am

IEDM 2014 was held in the second week of December 2014 in San Francisco. The excitement is over now and the dust has settled. Last week, at my leisure, I was glancing through the conference proceedings and short course material from IEDM 2014, when a slide from the 3DIC short course caught my attention. The slide presented below gives… Read More


The World’s Smallest Printed Circuit Boards: interposers

The World’s Smallest Printed Circuit Boards: interposers
by Paul McLellan on 04-27-2011 at 1:38 pm

Have you ever had the experience where you look up some unusual word in the dictionary since you don’t remember seeing it before. And then, in the next few weeks you keep coming across it. Twice in the last week I have been in presentations about the economics of putting die onto silicon interposers and the possibility of a new… Read More