Last week I presented at the 3D ASIP EDA Tutorial and attended the Conference. In previous years, leading edge papers were presented from large companies pushing a solution to meet their needs. These companies had the resources and clout to achieve some astounding successes, but the lingering question was: “what other product… Read More
Tag: interposers
3D-IC: Embedded Passives
IEDM 2014 was held in the second week of December 2014 in San Francisco. The excitement is over now and the dust has settled. Last week, at my leisure, I was glancing through the conference proceedings and short course material from IEDM 2014, when a slide from the 3DIC short course caught my attention. The slide presented below gives… Read More
The World’s Smallest Printed Circuit Boards: interposers
Have you ever had the experience where you look up some unusual word in the dictionary since you don’t remember seeing it before. And then, in the next few weeks you keep coming across it. Twice in the last week I have been in presentations about the economics of putting die onto silicon interposers and the possibility of a new… Read More