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3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
Until now, the integration and testing of IP blocks used in large SOCs has been a manual, time consuming design effort. A new standard called IEEE P1687 (or “IJTAG”) for IP plug-and-play integration is emerging to simplify these tasks. EDA tools are also emerging to support the new standard. Last week mentor announcedTessent IJTAG,… Read More
