New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) – Advanced gate stack and interconnect in VLSI processes and devices – Advanced lithography and fine patternig technologies for high density VLSI – New functional devices… Read More
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA
Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx.
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Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for … Read More
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International Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure… Read More
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers,… Read More
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Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable… Read More