Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036

Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
by Daniel Nenni on 10-10-2026 at 5:00 am

Hyper NA The Next Frontier in Chipmaking and When It Could Arrive

EUV has long been an interesting story. We have written 200+ articles on EUV and they just keep on coming. Thankfully the premier lithography conference is right here in Silicon Valley. SPIE began in 1955 as the Society of Photographic Instrumentation Engineers, bringing together engineers using scientific cameras and high-speed… Read More


ASML- Soft revenues & Orders – But…China 49% – Memory Improving

ASML- Soft revenues & Orders – But…China 49% – Memory Improving
by Robert Maire on 04-19-2024 at 8:00 am

Fully assembled TWINSCAN EXE 5000

ASML- better EPS but weaker revenues- 2024 recovery on track
China jumps 10% to 49%- Memory looking better @59% of orders
Order lumpiness increases with ASP- EUV will be up-DUV down
“Passing Bottom” of what has been a long down cycle

Weak revenues & orders but OK EPS

Reported revenue was Euro5.3B and EPS of Euro3.11… Read More


ASML Update SEMICON West 2023

ASML Update SEMICON West 2023
by Scotten Jones on 07-27-2023 at 10:00 am

12494 34 Bart Smeets Supporting future DRAM overlay and EPE roadmaps with the NXT2100i Page 21

At SEMICON West I had a chance to catch up with Mike Lercel of ASML. In this article I am going to combine ASML presentation material from the SPIE Advanced Lithography Conference, Mike’s SEMICON presentation, my discussions with Mike at SEMICON and a few items from ASML’s recent earnings call.

DUV

ASML continues to improve DUV systems.… Read More