In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More
The foundry model, multi-source IP blocks, advanced packaging technologies, cloud computing, hyper-connectivity and access to open-source software have all contributed to the incredible electronics products of recent times. Along with this, the complexity of developing and taking a chip to market has also increased. And… Read More
Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More
A couple months ago we heard from another vendor in a webinar on HBM and breaking through the “memory wall”. Next week Open Silicon weighs in on the topic in a webinar with partners SK Hynix and Synopsys.… Read More
Once upon a time, RAM technology was the driver of the semiconductor process. DRAM products were the first to be designed on a newest technology node and DRAM was used as a process driver. It was 30 years ago and the most aggressive process nodes were ranging between 1um and 1.5 um (1 500 nm!). Then in the 1990 the Synchronous Dynamic … Read More
