Webinar: Build Your Next HBM2/2E Chip with SiFive

Webinar: Build Your Next HBM2/2E Chip with SiFive
by Mike Gianfagna on 05-04-2020 at 10:00 am

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I have been watching the trend for quite some time now that many advanced FinFET designs today are actually 2.5D systems in package. All of these 2.5D silicon interposer-based designs have high-bandwidth memory (HBM) stacks on board.  Often there are multiple memory stacks in both 4-high and 8-high configurations. If you follow… Read More


16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP

16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
by Tom Simon on 09-29-2016 at 12:00 pm

Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More