Morris Chang Comments on Q2 2012: 28nm, 20nm, 16nm, FinFets, CAPEX, etc…

Morris Chang Comments on Q2 2012: 28nm, 20nm, 16nm, FinFets, CAPEX, etc…
by Daniel Nenni on 07-19-2012 at 5:42 pm

Twenty eight nanometer is progressing very well. Our output and our yields are both above the plans that we set for ourselves and the plans that we communicated to our customers early in the year. Early in the year means January-February of the year, we set our plans in output and in yields and we, of course, ever since then we tried toRead More


Synopsys Users Group Silicon Valley 2012 Keynote: Aart de Geus

Synopsys Users Group Silicon Valley 2012 Keynote: Aart de Geus
by Daniel Nenni on 03-27-2012 at 1:26 pm

SNUG Chairman John Busco opened the session with a few words about Aart de Geus, the silver anniversary of Synopsys, and some SNUG statistics. A whopping 2,500 people registered this year! Probably due to the Magma acquisition which is prominently displayed on “Welcome Magma Users” signs and on the flat screens which are everywhere.… Read More


3D Transistors @ TSMC 20nm!

3D Transistors @ TSMC 20nm!
by Daniel Nenni on 11-06-2011 at 12:51 pm

Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More


TSMC Versus Intel: The Race to Semiconductors in 3D!

TSMC Versus Intel: The Race to Semiconductors in 3D!
by Daniel Nenni on 06-26-2011 at 4:00 pm

While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor… Read More