Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand… Read More
Physical verification is an important and necessary step in the process to tapeout an IC design, and the foundries define sign-off qualification steps for:
This sounds quite reasonable until you actually go through the steps only to discover that some of the … Read More
Finding and debugging failures on integrated circuits has become increasingly difficult. Two sessions at ISTFA (International Symposium for Testing and Failure Analysis) on Thursday address the current best practices and research directions of diagnosis.
The first was a tutorial this morning by Mentor Graphics luminary… Read More
SEMICON West is coming up this July 10-12 at the Moscone Center in San Francisco. It covers a broad swath of the microelectronics supply chain, but I was particularly interested in the test sessions. Here are two that I recommend.
“The Value of Test for Semiconductor Yield Learning” on Tuesday, July 10, at 1:30p. The… Read More
OK, let’s face it, when you think of post-silicon debug then formal verification is not the first thing that springs to mind. But once a design has been manufactured, debugging can be very expensive. As then-CEO of MIPS John Bourgoin said at DesignCon 2006, “Finding bugs in model testing is the least expensive and most desired… Read More
