IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)
by Admin on 07-23-2024 at 8:22 pm

About PAINE

Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable

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The Strategic Materials Conference—SMC 2024

The Strategic Materials Conference—SMC 2024
by Admin on 07-23-2024 at 7:52 pm

MATERIALS REVOLUTION:  Shaping the Future of Electronics & Beyond, and the Impact of AI

The Strategic Materials Conference—SMC attracts an influential audience from every segment of the semiconductor manufacturing industry.
Get insights on current developments in advanced materials. SMC is a valuable, productive… Read More


Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update

Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update
by Admin on 06-21-2024 at 3:07 pm

Join us for an exclusive webinar during Ansys 2024 R2 updates. We’ll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities.

TIME:
JULY 18, 2024
11 AM EDT

Venue:
Virtual

Overview

This Ansys 2024 R2 webinar

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Webinar: Thermal Solutions for Electronics Design

Webinar: Thermal Solutions for Electronics Design
by Admin on 04-12-2024 at 1:58 pm

Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate… Read More