At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Tag: drc
ECO Demo Update from Easy-Logic
I first met Jimmy Chen from Easy-Logic at #60DAC and wrote about their Engineering Change Order (ECO) tool in August 2023. Recently we had a Zoom call so that I could see a live demo of their EDA tool in action. Allen Guo, the AE Manager for Easy-Logic gave me an overview presentation of the company and some history to provide a bit of context.… Read More
Checking and Fixing Antenna Effects in IC Layouts
IC layouts go through extensive design rule checking to ensure correctness, before being accepted for fabrication at a foundry or IDM. There’s something called the antenna effect that happens during chip manufacturing where plasma-induced damage (PID) can lower the reliability of MOSFET devices. Layout designers run Design… Read More
Soft checks are needed during Electrical Rule Checking of IC layouts
IC designs have physical verification applications like Layout Versus Schematic (LVS) at the transistor-level to ensure that layout and schematics are equivalent, in addition there’s an Electrical Rules Check (ERC) for connections to well regions called a soft check. The connections to all the devices needs to have the most… Read More
Successful 3DIC design requires an integrated approach
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Unlock first-time-right complex photonic integrated circuits
The capacity and energy efficiency challenges from the growing appetite for high-speed data along with advanced applications such as LIDAR and quantum computing are driving demand for increasingly large-scale photonic integrated circuits (PIC). With an ever-increasing number of components on a single photonic chip, manual… Read More
EDA in the Cloud – Now More Than Ever
A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More
RealTime Digital DRC Can Save Time Close to Tapeout
Over the years DRC tools have done an admirable job of keeping pace with the huge growth of IC design size. Yet, DRC runs for sign off on the full design using foundry rule decks take many hours to complete. These long run times are acceptable for final sign off, but there are many situations where DRC results are needed quickly when small… Read More
Analysis of Curvilinear FPDs
This area of automating the design of Flat Panel Displays (FPD) is so broad that it has taken me three blogs to cover all of the details, so in brief review the first two blogs were:
My final blog covers five areas:
- DRC/LVS for curvilinear layout
- Circuit
Calibre Commences Cloud Computing
Calibre was a big game changer for DRC users when it first came out. Its hierarchical approach dramatically shortened runtimes with the same accuracy as other existing, but slower, flat tools. However, one unsung part of this story was that getting Calibre up and running required minimal effort for users. Two things are required… Read More