TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019

TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019
by Don Draper on 02-05-2020 at 10:00 am

Diagram of BEOL metallization comparing EUV vs. immersion photolithography

Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020.  This 5nm technology is a full node scaling from 7nm using smart scaling… Read More


IEDM 2019 Press Lunch Exposed!

IEDM 2019 Press Lunch Exposed!
by Daniel Nenni on 12-10-2019 at 6:00 am

One of the many benefits of blogging for SemiWiki is the free conference passes and buffet lunches, absolutely. IEDM is one of the more prestigious semiconductor conferences, now in its 65th year, is being held at the Hilton Hotel in San Francisco’s famed Union Square this week. This year more than 1,910 semiconductor professionals… Read More