Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the prefaceRead More


TSMC Theater Presentation: Atrenta SpyGlass!

TSMC Theater Presentation: Atrenta SpyGlass!
by Daniel Nenni on 06-13-2012 at 9:10 am

Atrenta presented an update on the TSMC Soft IP Alliance Program at TSMC’s theater each day at DAC. Mike Gianfagna, Atrenta VP of Marketing, presented an introduction to SpyGlass, an overview of the program and a progress report. Dan Kochpatcharin, TSMC Deputy Director of IP Portfolio, was also there. Between Mike, Dan, and I there… Read More