Eight Improvements for PCB Software

Eight Improvements for PCB Software
by Daniel Payne on 05-04-2016 at 12:00 pm

I first met John Durbetaki at Intel in Aloha, Oregon and we both had a keen interest in the nascent personal computer industry. My first PC was made by Radio Shack and dubbed the TRS-80 which maxed out at 48KB of RAM. I kept watch on Durbetaki as he left Intel and formed his own company OrCAD in 1985 to serve the needs of PC-based CAD software.… Read More


Saving Time and Money on Your Next SoC Project

Saving Time and Money on Your Next SoC Project
by Daniel Payne on 05-12-2015 at 8:00 pm

Every SoC project that I know of wants to finish on time, under budget, and maximize profits per device. When I first started out doing DRAM design I learned that we could maximize profit by doing shrinks of existing designs, move from ceramic to plastic packages, and reduce the amount of time spent on a tester. Today, the economic … Read More


How to meet 3Ps in 3D-ICs with sub-20nm Dies?

How to meet 3Ps in 3D-ICs with sub-20nm Dies?
by Pawan Fangaria on 03-06-2014 at 1:30 am

It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More