Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 06-16-2022 at 12:00 am

Date: Thursday, June 16, 2022

Time: 11:00am – 12:00pm (PDT)

Overview

System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow. Large pin counts of flipped and rotated ICs may… Read More


Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows

Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
by Admin on 06-14-2022 at 12:00 am

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped and rotated

Read More

CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI

CadenceTECHTALK: Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows – EMEAI
by Admin on 06-14-2022 at 12:00 am

EMEAI Session

Date: Tuesday, June 14, 2022

Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST

System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped

Read More

Keynote from Google at CadenceLIVE Americas 2021

Keynote from Google at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-14-2021 at 10:00 am

CDNLive Americas 2021

Last week, Cadence hosted its annual CadenceLIVE Americas 2021 conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

One of the keynotes was from Partha Ranganathan, VP and Engineering Fellow from Google. His talk was titled,… Read More


Chips and pins and layers within

Chips and pins and layers within
by Don Dingee on 03-25-2015 at 3:00 pm

After teams sweat the details of SoC and industrial design, they turn to printed circuit board designers for magic. Here are a pile of chips and passives, and a schematic for interconnecting them. This is how much physical space the board can occupy. Connectors have to be here, and here, and mounting holes there, and there. There … Read More


Adding a Digital Block to an Analog Design

Adding a Digital Block to an Analog Design
by Daniel Payne on 10-30-2014 at 7:00 am

My engineering background includes designing at the transistor-level, so I was drawn to attend a webinar today presented by Tanner EDAand Incentia about Adding a Digital Block to an Analog Design. Many of the 30,000 users of Tanner tools have been doing AMS designs, so adding logic synthesis and static timing analysis from IncentiaRead More


DVCon: Hardware/software Co-design from a Software Perspective

DVCon: Hardware/software Co-design from a Software Perspective
by Paul McLellan on 02-09-2012 at 4:56 am

The EDAC Emerging Companies Comittee (would that be the EDACECC?) is organizing a free panel session one evening at DVCon. It is Monday February 27th from 6pm to 8.30pm. I don’t yet have a room but it will be at the DoubleTree Hotel where DVCon is being held.

EDA companies often address hardware/software co-design from a hardware… Read More