At SemiWiki we’ve written four times now about how TSMC is standardizing on a 3DIC physical flow with their approach called 3Dblox, so I watched a presentation from John Ferguson of Siemens EDA to see how their tool flow supports this with the Calibre tools. With a chiplet-based packaging flow there are new physical verification… Read More
My third event at DAC on Monday was all about using EDA tools in the Cloud, and so I listened to Craig Johnson, VP EDA Cloud Solutions, Siemens EDA. Early in the day I heard from Joe Sawicki, Siemens EDA, on the topic of Digitalization.
Why even use the Cloud for EDA? That’s a fair question to ask, and Craig had several high-level… Read More
Mentor, A Siemens Business, just released a new white paper entitled, “The True Costs of Process Node Migration” written by John Ferguson. This is a good quick read that highlights some of the key areas that are often over looked when contemplating a shift of process nodes for your next design.
When considering a shift to a more advanced… Read More
