Todd Burkholder and Andras Vass-Varnai, Siemens EDA
As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More
We all know semiconductor design is getting harder. Much harder when you consider the demands of AI workloads and heterogeneous integration of many chiplets in a single package. This class of system demands co-optimization across the entire design flow. For example, functional verification, thermal analysis, signal and power… Read More
The week before DAC I had the privilege to take a video call with Pradeep Thiagarajan – Product Manager, Simulation, Custom IC Verification at Siemens EDA to get an update on new simulation products. I’ve been following Solido for years now and knew that they were an early adopter of ML for Monte Carlo simulations with SPICE users.… Read More
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
