What’s Behind Carbon System Exchange – How Will it Scale?

What’s Behind Carbon System Exchange – How Will it Scale?
by Pawan Fangaria on 10-01-2014 at 4:00 pm

Earlier this year, when I was looking at Carbon’spast year performance which provided record breaking revenue with whopping jump in bookings, one thing was certain that Carbon Performance Analysis Kits (CPAKs) would drive major growth in future, not only for Carbon, but also for the semiconductor industry. It will initiate … Read More


Optimize Your Interconnect & Design at System Level for Best Results

Optimize Your Interconnect & Design at System Level for Best Results
by Pawan Fangaria on 09-16-2014 at 7:00 am

As the SoC design size, complexity and functionality keeps on increasing with multiple IPs packed together and design time and time-to-market keeps on decreasing amid critical constraints on PPA, there is no other alternative than to do the design first-time-right not to miss the window of opportunity. And that could be possible… Read More


Carbon Design Systems – Secret of Success

Carbon Design Systems – Secret of Success
by Pawan Fangaria on 02-19-2014 at 11:00 am

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Last week, after learning from the press releaseof Carbonabout its rocking sustained growth with record-breaking revenue and a thumping 46% increase in bookings, I was interested to know some more details about what drives Carbon to such an amazing performance in an EDA market that is generally prone to growth of… Read More


How to Develop Accurate Yet High Performance Models

How to Develop Accurate Yet High Performance Models
by Pawan Fangaria on 01-13-2014 at 12:00 pm

In today’s environment of semiconductor design, SoCs are crammed with various IPs with multiple functionalities and processors integrated together. In such an event it has become necessary to model the system and verify on Virtual Platform before getting into actual design and fabrication. And that requires modelling of each… Read More


Getting the Most Out of the ARM CoreLink™ NIC-400

Getting the Most Out of the ARM CoreLink™ NIC-400
by Daniel Payne on 10-28-2013 at 12:27 pm

SoC designers are attracted to ARM as an IP provider because of their popular offerings and growing ecosystem of EDA partners like Carbon Design Systems. At the upcoming ARM Techcon on October 31 this week in Santa Clara you’ll have an opportunity to hear a joint presentation from ARM and Carbon Design Systems on: Getting Read More