Design IP revenues achieved $8.5B in 2024 and this is an all-time-high growth of 20%. Wired Interface is still driving Design IP growth with 23.5% but we see the Processor category also growing by 22.4% in 2024. This is consistent with the Top 4 IP companies made of ARM (mostly focused on processor) and a team leading wired interface… Read More
Tag: automotive
Keysom and Chipflow discuss the Future of RISC-V in Automotive: Progress, Challenges, and What’s Next
by, Tomi Rantakari CEO ChipFlow & Luca Testa COO Keysom
The automotive industry is undergoing a major transformation, driven by electrification, the rise of new market players, and the rapid adoption of emerging technologies such as AI. Among the most significant advancements is the growing adoption of RISC-V, an open-standard… Read More
Webinar: 5 Key Trends Shaping Automotive Electronics in 2025 and beyond
Key Insights on AI, EVs, and Semiconductor Trends
The automotive industry has long evolved gradually—but 2024 proved to be anything but typical. With major automaker CEOs resigning and suppliers facing unexpected challenges, including a downturn in semiconductor demand despite increasing chip content per vehicle, the landscape
TSMC Boston Technology Workshop 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
TSMC Austin Technology Workshop 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
TSMC North America Technology Symposium 2025
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
TRNG for Automotive achieves ISO 26262 and ISO/SAE 21434 compliance
The security of a device or system depends mainly on being unable to infer or guess an alphanumeric code needed to gain access to it or its data, be that a password or an encryption key. In automotive applications, the security requirement goes one step further – an attacker may not gain access per se, but if they can compromise vehicle… Read More
Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More
Soitec: Materializing Future Innovations in Semiconductors
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More