The semiconductor industry has gone through several major transitions driven by different dynamics such as shift in business models (fab-centric to fab-less), product segmentation (system design house, IP developers) and end market applications (PC to cloud; and recently, to both automotive and Internet of Things — IOT’s,… Read More
Tag: ansys
Data Security – Why It Might Matter to Design and EDA
According to the Economist, “The world’s most valuable resource is no longer oil, but data”. Is this the case?Data is the by-product ofmany aspects of recent technology dynamics and is becoming the currency of today’s digital economy. All categories in Gartner’s Top10 Strategic Technology Trends for 2018 (Figure… Read More
TechCon: See ANSYS and TSMC co-present
ANSYS and TSMC will be co-presenting at ARM TechCon on Multiphysics Reliability Signoff for Next Generation Automotive Electronics Systems. The event is on Thursday October 26th, 10:30am-11:20am in Grand Ballroom B.
You can get a free Expo pass which will give you access to this event HERE and see the session page for the event … Read More
Webinar: Chip-Package-System Design for ADAS
When thinking of ADAS from an embedded system perspective, it is tempting to imagine that system can be designed to some agreed margins without needing to worry too much about the details of the car environment and larger environment outside the car. But that’s no longer practical (or acceptable) for ADAS or autonomous systems.… Read More
ESDA Event: Power and Policy in California
Apparently this event is now being postponed until sometime later in the year. Stay tuned
We spend a lot of our time with our heads down in the technical details and when we look up at what we think is the big picture, it’s usually just a little bit bigger, often no more than a justification for immediate product directions. So wouldn’t… Read More
Executive Interview: Vic Kulkarni of ANSYS
Having known Vic for many years, it is always great to spend time with him and catch up on what is happening inside the semiconductor ecosystem. As Senior Vice President and General Manager, RTL Power Business, at ANSYS in Silicon Valley, Vic spends a lot of time in the field with customers, partners, and at industry events so he has… Read More
Integrity and Reliability in Analog and Mixed-Signal
In the largest and fastest growing categories in electronics – mobile, IoT and automotive – analog is playing an increasingly important role. It’s important in delivering high integrity power and critical signals to the design though LDO regulators and PLLs, in managing high speed interfaces like DDR and SERDES, in interfacing… Read More
Free Webinar: Designing Low-Power IoT Systems
As I have written before, IoT looks to be a key driver for design starts and future semiconductor revenue growth which is why we wrote “PROTOTYPICAL” and included a field guide to FPGA Prototyping. If you want to get funding for your new IoT chip project, having a working prototype is a good thing, absolutely. If you want to take a look… Read More
Power Noise Sign-off at #53DAC
When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More
"Re-Inventing" Tapeout Sign-off — Applying Big Data Techniques to Electrical Analysis
A common SoC design methodology in current use starts with preparation of the physical floorplan — e.g., block/pin placement, global clock domain and bus signal planning, developing the global/local power distribution (and dynamic power domain management techniques). Decoupling capacitor estimated densities and… Read More